| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Standard active cooling solution for high performance COM Express module conga-TFS with 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
|
暂无价格
|
参考库存:41011
|
|
|
|
|
散热片
|
|
散热片 Board Level Heatsink, Vertical Mounting, 25.4x41.91x63.5mm
|
暂无价格
|
参考库存:41016
|
|
|
|
|
散热片
|
|
散热片 Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
|
暂无价格
|
参考库存:41021
|
|
|
|
|
散热片
|
|
散热片 Compression Mounting Clamp Assemblies for Semiconductors to 88.9mm Diameter, 5000lb, 110.0 to 119.4mm
|
暂无价格
|
参考库存:41026
|
|
|
|
|
散热片
|
|
散热片 maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, Saint-Gobain C675, 32.5x32.5x12.5mm
|
暂无价格
|
参考库存:41031
|