| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Extruded Style Heatsink with Solderable Pins for TO-220, Flat-Back, Vertical Mounting, 16.8 n Thermal Resistance, Black Anodized, 2.67mm Hole, 38.1mm
|
1:¥10.4525
10:¥9.831
25:¥9.605
50:¥9.379
|
参考库存:27316
|
|
|
|
|
散热片
|
|
散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x10mm, IC Pkg Size = 35 x 35, Tape #32
|
1:¥15.0629
10:¥14.6787
25:¥14.2154
50:¥13.447
|
参考库存:24153
|
|
|
|
|
散热片
|
|
散热片 BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 26.25x26.25x9.5mm, 26.25mm dia.
|
1:¥102.039
10:¥96.3551
50:¥85.0664
100:¥79.3712
|
参考库存:6770
|
|
|
|
|
散热片
|
|
散热片 maxiFLOW Power Brick Heatsink, Eighth Brick, Gold-Anodized, T766, Hardware, 58x23x11.4mm, 23mm dia.
|
1:¥66.8508
10:¥65.088
50:¥57.856
100:¥54.2513
|
参考库存:6392
|
|
|
|
|
散热片
|
|
散热片 25.4x42x25mm w/pin extrusion TO-218
|
1:¥10.1474
10:¥9.6841
25:¥9.2208
50:¥8.9948
|
参考库存:8554
|